Chief Technology Officer - Ingot and Wafer Manufacturing

Head Technology / CTO Responsibilities Strategic Process Development: Lead the optimization of ingot and wafer manufacturing processes to achieve organizational goals, using techniques like Czochralski and float-zone methods to enhance quality and efficiency. Departmental Leadership and Coordination: Provide direction to the ingot and wafer technology team and coordinate with cross-functional teams to align projects with company objectives. Quality Control and Assurance: Establish and enforce quality control measures to ensure ingot and wafer products meet standards of purity and integrity, overseeing PFMEA implementation. Technological Advancements and Industry Trends: Stay updated on innovations in ingot and wafer technology and integrate advancements to maintain competitiveness and drive innovation. Budget and Resource Management: Develop business plans and budgets for projects, ensuring effective resource allocation to complete initiatives on time and within budget. Technical Reporting and Documentation: Deliver high-level technical presentations and oversee the preparation of reports to support regulatory approvals and quality standards. Process Innovation and Improvement: Drive continuous improvement initiatives to enhance product quality and efficiency, implementing best practices and new methodologies in manufacturing processes. Team Leadership and Development: Lead and mentor the Ingot & Wafer technology team, fostering a culture of innovation and providing training to keep the team updated on advancements. Digitalization/Data-Driven Decision Making: Overseeing digital transformation across the division, ensuring data-driven strategies are embedded organization-wide. Organizational & Culture Building: Cultivating an agile and engaging organizational culture, aligning workforce values with strategic goals. Leadership in Change Management: Leading large-scale change management initiatives, ensuring smooth transitions and adoption of new technologies across teams. People Development : Leading from the front & being accountable for the professional growth of your teams. Developing/conducting/promoting training & learning initiatives to enhance skills & empowering them to take ownership of key processes and decisions. Key Stakeholders - Internal: Head of Department (HOD) R&D Test Leader - Ingot and Wafer Technology Process Leads (MG Silicon and Poly Silicon) Design Leads (MG Silicon and Poly Silicon) Quality Assurance Team Key Stakeholders - External: Customers Material Suppliers Industry Associations Regulatory Bodies Consultants Qualifications Educational Qualification: B.Tech in Mechanical Engineering, or a related field. MTech is preferred. Work Experience (Range of years): Minimum 10-15 years of experience in ingot and wafer technology, with a track record of leading process development and optimization. Certification: